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Laser processing machine Product List

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Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

A short pulse laser processing machine used for drilling and cutting silicon wafers!

The "Short Pulse Laser Processing Machine" is a processing machine that is applied to drilling, cutting of silicon wafers, and laser patterning of thin-film solar cell materials due to its features such as high output and fine processing. Additionally, it is used for cutting and drilling of lithium battery metal films, substrate cutting, and sapphire cutting. 【Features】 ■ Output: 20W, Pulse Width: 100ps ■ Peak Power Output: 300kW ■ Frequency: Adjustable from 30kHz to 1000kHz ■ Pulse Energy: 300μJ@1ns ■ Beam Quality: M2 < 1.3 *For more details, please request materials or view the PDF data available for download.

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Laser processing machine

Laser processing machine

Fiber laser processing machine suitable for fine processing such as marking, cutting, and drilling.

The "Laser Processing Machine" is a device that excels in beam quality due to its fiber output. The fiber is thin and has a large surface area, resulting in high cooling efficiency, easy maintenance, and excellent long-term stability. Since it does not use ink, cost reduction and recycling benefits can be expected. 【Features】 ■ Excellent beam quality due to fiber output ■ High cooling efficiency ■ Easy maintenance ■ Excellent long-term stability ■ Cost reduction and recycling benefits *For more details, please refer to the PDF document or feel free to contact us.

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  • Laser marker

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Ultraviolet (UV) laser processing machine

Ultraviolet (UV) laser processing machine

Processing with minimal thermal impact has been achieved for materials that were previously difficult to process!

The "Ultraviolet (UV) Laser Processing Machine" is a device capable of processing electronic components and organic materials with minimal thermal impact. Since UV lasers have high energy photons, they can directly separate molecular bonds when irradiating organic substances. 【Features】 ■ Capable of processing with minimal thermal impact ■ Can directly separate molecular bonds when irradiating organic substances *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Laser marker

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